Facility + Tools

State-of-the-art quantum nano-fabrication facility

Located on the east campus of the 91PORN, the NQN involves approximately 3,600 square feet of new construction that will expand the footprint of the Sustainability, Energy & Environment Laboratory (SEEL) building.

Strategically situated adjacent to existingÌýColorado Shared Instrumentation in Nanofabrication and Characterization (COSINC) cleanroom and material characterization facilities, the NQN will house advanced equipment available for quantum research and includes:

  • 2,768 square feet ISO 5/6 clean room
  • 560 square feet mechanical equipment space
  • 156 sq. ft. loadlock vestibule
  • 115 sq. ft. storage space
  • Contained equipment

The NQN facility will be physically annexed to the existing COSINC ISO 5 cleanroom facility as key quantum device process steps such as optical and nanolithography, including wet processing will occur in the current cleanroom. NQN’s operations and administrative support will be integrated with COSINC, including access, user training, user scientific and technical assistance.

NQN Conceptual Exterior Rendering

Exterior rendering of NQN facility

NQN will feature 30 quantum device nanofabrication tools.

Optical profilometer
Spectroscopic ellipsometer
Nanyte BEAM
Signatone-210
Scanning electron microscope

From left: Sensofar metrology optical profilometer, J.A. Woollam M-2000 spectroscopic ellipsometer, Nanyte BEAM photonics wire bonder, Signatone CM-210 4-point probe, FEI Scios 2 HiVac scanning electron microscope.

Lithography

Mask aligner
OAI 806 EIR (front and back side)

Mask laser writer
Raith PICOMASTER XF 200 (direct write)

Thin film deposition

Thermal evaporator
Angstrom Engineering NextBase

Sputter coater
Angstrom Engineering SputterBase

Atomic layer deposition
Forge Nano Theia

Rapid thermal annealer
Solaris 150

E-beam evaporator
Angstrom Engineering Quantum Series (Ar ion milling)

Low pressure chemical vapor deposition
Tystar Tytan Mini 3600

Plasma enhanced chemical vapor deposition
Plasma-Therm Corial D250L

Metrology

Optical profilometer
Sensofar Metrology S neox 3D

Contact profilometer
KLA Tencor® P-7

4-point probe
Signatone CM-210

Spectroscopic ellipsometer
J.A. Woollam M-2000

Optical microscope
KEYENCE VHX-X1 (up to 150x)

Scanning electron microscope
FEI Scios 2 HiVac (focused ion beam)

Ìý

Thermal processing

Vacuum ovens
Yield Engineering Systems YES-310TA DualÌý

Digital hotplates
SiSTEM Technology Apogee Bake Plate

Etchers

ICP RIE
Plasma-Therm Corial 210IL (Nitride/Si-based materials)

ICP RIEÌý
Plasma-Therm Takachi (III-V)

ICP RIE (Versaline DSE) (Metals)
Plasma-Therm Corial 210IL (Li Niobate)

HF vapor etcher
KLA Primaxx® uEtch

Asher
Yield Engineering Systems YES-CV200RFS (O2 plasma)

Packaging

Wafer bonding
SiSTEM Technology Apogee Temporary Wafer Bonder

Wire bonding
WestBond 7KF (Al, automatic)

Wire bonder
WestBond 7KF (Au)

Flip-chip bonder
SETNA AccµRa-M

Critical point dryer
Leica EM CPD300

Scribe and break tool
Ted Pella PELCO® LatticeAx® 420

Photonics wire bonding
NANYTE BEAM (fiber to chip, chip to chip)

Wafer dicing saw
Disco DAD3221

Toxic gas cabinets

Gas cabinets
Stainless Design Concepts Ìý(Cl2, BCl3, SiH4, NH3)

Scrubber
Stainless Design Concepts (abatement system)

Site location on the east side of the SEEL facility.

NQN locator map